IC Package Reliability Test-Environment Test

To lower IC product failure rate and make sure life time, reliability test is an essential part for IC product testing.

Test item: Precondition

Test purpose: To simulate storage condition with specified temperature and humidity to evaluate endurance of IC products before use, also it means reliability of storage from manufacture to use.

Test procedure:

1. SAM (Scanning Acoustic Microscopy)

2. TC (Temperature Cycling)

-40℃(or lower)~60℃(or higher) for 5 cycles to simulate shipping conditions

3. Baking

At min. 125℃ for 24h to remove all moisture from the package

4. Soaking

Using one of following soak conditions

-Level 1: 85℃/ 85% Rh for 168h

-Level 2: 85℃/ 60% Rh for 168h

-Level 3: 30℃/ 60% Rh for 192h

5. Reflow

240℃(-5℃)/ 225℃(-5℃) for 3 times (Sn-Pb)

245℃(-5℃)/ 250℃(-5℃) for 3 times (Pb-free)

*Choose according the package size

6. SAM (Scanning Acoustic Microscopy)

Test standard: JESD22-A113-D

Test item: HTSL-High Temperature Storage Life

Test purpose: Evaluate IC products storage life under condition of higher temperature before actual use.

Test condition: 150℃for 1000h

Test standard: JESD22-A103-A

Test item: PCT-Pressure Cook Test

Test purpose: Evaluate resistance ability of IC products under condition of high temperature, high humidity and pressure.

Test condition: 121℃, 2atm(205kPa), 100%R.H., 168h

Test standard: JESD22-A102

Test item: THB-Temperature Humidity Bias Life

Test purpose: Evaluate the reliability of IC products in humid environments. Temperature, humidity and bias conditions are applied to accelerate the penetration of moisture through the external protective material or along the interface between the external protective material and the metallic conductor which pass through it.

Test condition: 85℃, 85%R.H., 1000h

Test standard: JESD22-A101D

Test item: TCT-Temperature Cycling Test

Test purpose: Determine the ability of components and solder interconnects to withstand mechanical stresses induced by alternating high and low temperature extremes.

Test condition: Condition B: -55℃~+125℃/ Condition C: -65℃~+150℃

Test standard: JESD22-A104

Test item: HAST-Highly Accelerated Stress Test

Test purpose: Evaluate the reliability of IC products in humid environments. It is a highly accelerated test which employs temperature and humidity under non-condensing conditions to accelerate the penetration of moisture through the external protective material or along the interface between the external protective material and the metallic conductor which pass through it.

Test condition: 130℃, 85%, 2.3atm(230kPa), 96h

Test standard: JESD22-A118